Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate

International Conference on Innovative Research - ICIR Euroinvent 2016

Efzan, M. N. Ervina^1,2 ; Ng, W.L.^1 ; Abdullah, Mohd Mustafa Al Bakri^2,3

Faculty of Engineering and Technology, Multimedia University, Ayer Keroh, Malacca

75450, Malaysia^1

Center of Excellence Geopolymer and Green Technology (CeGeoGTech), School of Material Engineering, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia^2

Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia^3

关键词: Copper substrates;    Low temperatures;    Solder alloys;    Solids flux;    Spread areas;    Watersoluble;    Working temperatures;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/133/1/012024/pdf
DOI  :  10.1088/1757-899X/133/1/012024

来源: IOP

【 摘 要 】

This paper investigated the effect of different types of fluxes on the wettability of a type of low temperature lead-free solder, 60Sn-40Bi alloy. The purpose of this paper is to investigate the effect of different types of fluxes on the wettability of 60Sn-40Bi solder (Tm: 138 -170oC), so that the most compatible flux to be used with low temperature alloy can be determined.The results of this paper showed that the water soluble flux sample has the highest spread area and lowest contact angle. This meant that the solder has the highest wettability when water soluble flux is used, followed by RMA flux and low solids flux. Therefore, it was determined that water soluble flux is the most compatible to be used with the low temperature 60Sn-40Bi solder. The characteristic of this type of flux enables it to function well even at a low working temperature.