The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review

Malaysian Technical Universities Conference on Engineering and Technology 2017

Mahim, Z.^1 ; Salleh, M.A.A.^1 ; Khor, C.Y.^2

Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Perlis, Arau

02600, Malaysia^1

Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP) Aras 1, Kampus UniCITI Alam Sungai Chuchuh, Padang Besar, Perlis, Malaysia^2

关键词: Electronic device;    Oxidation layers;    Sn whisker;    Solder alloys;    Tin whisker;    Whisker growth;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/318/1/012063/pdf
DOI  :  10.1088/1757-899X/318/1/012063

来源: IOP

【 摘 要 】

In order to reduce the Tin (Sn) whisker growth phenomenon in solder alloys, the researcher all the world has studied the factor of this behaviour. However, this phenomenon still hunted the electronic devices and industries. The whiskers growth were able to cause the electrical short, which would lead to the catastrophic such as plane crush, the failure of heart pacemaker, and the lost satellite connection. This article focuses on the three factors that influence the whiskers growth in solder alloys which is stress, oxidation layer and temperature. This findings were allowed the researchers to develop various method on how to reduce the growth of the Sn whiskers.