Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Malaysian Technical Universities Conference on Engineering and Technology 2017

Nordarina, J.^1 ; Mohd, H.Z.^1 ; Ahmad, A.M.^2 ; Muhammad, F.M.N.^1

Centre of Excellent Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis, Jejawi, Perlis, Arau

02600, Malaysia^1

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal, Penang

14300, Malaysia^2

关键词: Acidic solutions;    Corrosion behaviour;    Corrosion products;    Corrosion property;    Deep groove;    Morphological analysis;    Phase analysis;    Solder alloys;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/318/1/012003/pdf
DOI  :  10.1088/1757-899X/318/1/012003

来源: IOP

【 摘 要 】

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).