Influence of Nano-3%Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy

2nd International Conference on Materials Engineering and Nanotechnology

材料科学;物理学

Amares, S.^1 ; Ervina Efzan, M.N.^2 ; Durairaj, Rajkumar^3 ; Niakan, Aliasghar^1

Faculty of Engineering and Built Environment, SEGi University, No. 9, Jalan Teknologi, Taman Sains Selangor, Kota Damansara PJU 5, Selangor, Petaling Jaya

47810, Malaysia^1

Faculty of Engineering and Technology, Multimedia University, Ayer-Keroh-Melaka

75450, Malaysia^2

Lee Kong Chian Faculty of Engineering and Science, Universiti Tunku Abdul Rahman, Jalan Sungai Long, Bandar Sungai Long, Selangor, Kajang

43000, Malaysia^3

关键词: Electronic packaging industry;    Lead-free solder alloy;    Low temperatures;    Sn grains;    Solder alloys;    Work study;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/205/1/012002/pdf
DOI  :  10.1088/1757-899X/205/1/012002

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

This work studies the melting temperature, wettability, metallurgical and hardness properties of the Sn-58Bi (SB) lead-free solder alloy incorporated with nano-3%Al2O3. The melting temperature was observed at 143.44°C upon the additions of the nano-3%Al2O3with a low contact angle of 20.4°. A well-distributed microstructure with narrower lamellar structure and finer intermetallic compounds and Sn grains was detected for the nano-3%Al2O3added SB solder alloy. Hardness evaluation based on the Vickers hardness value was as high as 17.1Hv. Overall, the Sn-58Bi + 3% Al2O3solder alloy appears to harvest beneficial results for these properties and can be used as potential replacement in the current electronic packaging industry.