Nickel (Ni) Microalloying Additions in Sn-Cu Lead-free Solder. Short Review

International Conference on Innovative Research - ICIR Euroinvent 2017

Mohd Salleh, M.A.A.^1 ; Sandu, I.G.^1,2 ; Abdullah, M.M.A.^1,3 ; Sandu, I.^1,4 ; Saleh, N.A.^1

Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia^1

Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, Romania^2

Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia^3

Laboratory of Scientific Investigation, Arheoinvest Platform, Alexandru Ioan Cuza University of Iasi, Romania^4

关键词: Digital age;    Electronic packaging industry;    Electronics devices;    Hexagonal structures;    Lead-free solder alloy;    Mechanical support;    Microalloying addition;    Solidification structure;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/209/1/012084/pdf
DOI  :  10.1088/1757-899X/209/1/012084

来源: IOP

【 摘 要 】

In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of two or more addition of microalloying. By microalloying addition, the solidification structure can be modified. This paper reviews the addition of Ni as microalloying in Sn-Cu lead free solder. Small additions of Ni resulted with an improvement of solder in microstructure and in intermetallic compounds. The stabilization of hexagonal structure of Cu6Sn5in lead-free solder alloys occurred due to present of Ni.