Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application

International Conference on Recent Advances in Industrial Engineering and Manufacturing

工业技术（总论）

Iqbal, A.M.^1^2 ; Aziz, M.S.A.^1 ; Abdullah, M.Z.^1 ; Ishak, M.H.H.^1

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Penang

14300, Malaysia^1

Faculty of Bioengineering and Technology, Universiti Malaysia Kelantan, Jeli Campus, Locked Bag No. 100, Jeli, Kelantan

17600, Malaysia^2

关键词: Electronics devices;    Flexible printed circuit boards;    Reflow--soldering;    Reynold number;    Surface temperatures;    Surface variations;    Temperature prediction;    Thermal profiles;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/530/1/012019/pdf
DOI  :  10.1088/1757-899X/530/1/012019

学科分类：工业工程学

来源: IOP

【 摘 要 】

Flexible printed circuit boards (FPCBs) appoint an interest in current electronics devices with unique capabilities in the form of flexibility, lightweight, and thin thickness. In this paper, the proposed of that utilises FPCB as a substrate for motherboards is investigated. Assembly surface variation temperature in the reflow soldering process is a crucial factor to address the feasibility of substrate for surface mount technology (SMT) applications. For thin FPCB, higher Reynold number (Re) would not give the significant effect of heat transfer on assembly surface temperature. Although the primary focus is in a continuous reflow oven, FPCB findings could enhance the information for other FPCB applications such as designing the soldering thermal profile.