Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint

Joining and Welding Symposium

金属工艺学

Dele-Afolabi, T.T.^1 ; Azmah Hanim, M.A.^1,4 ; Norkhairunnisa, M.^2,4 ; Suraya, M.T.^1 ; Yusoff, H.M.^3

Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, UPM Serdang Selangor

43400, Malaysia^1

Department of Aerospace Engineering, Faculty of Engineering, Universiti Putra Malaysia, UPM Serdang Selangor

43400, Malaysia^2

Department of Chemical and Environmental Engineering, Faculty of Engineering, Universiti Putra Malaysia, UPM Serdang Selangor

43400, Malaysia^3

Laboratory of Biocomposite Technology, Institute of Tropical Forestry and Forest Products (INTROP), Universiti Putra Malaysia, UPM Serdang, Selangor Darul Ehsan

43400, Malaysia^4

关键词: Atoms diffusion;    Composite solders;    Isothermal aging;    Microstructural evaluation;    Peak temperatures;    Reflow--soldering;    Reinforcement materials;    Surface instability;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/238/1/012010/pdf
DOI  :  10.1088/1757-899X/238/1/012010

来源: IOP

【 摘 要 】

In this study, the effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints are evaluated. Plain and carbon nanotubes (CNTs) reinforced Sn-5Sb solder systems with solder formulations Sn-5Sb, Sn-5Sb-0.01CNT, Sn-5Sb-0.05CNT and Sn-5Sb-0.1CNT were prepared through the powder metallurgy route and thereafter samples were subjected to thermal and microstructural evaluation. As retrieved from the DSC scans, a slight decline in the peak temperature was observed in the composite solders which is indicative of the CNTs role in exciting surface instability in the host Sn matrix. In order to prepare the solder joints and analyze the interfacial intermetallic compound (IMC) evolution, respective solder systems were placed on copper (Cu) substrate and subjected to both reflow soldering and isothermal aging (170°C) conditions. From the IMC thickness result, considerable retardation in the IMC layer growth was observed in the CNTs reinforced solder joints, especially the 0.05wt.% CNTs solder system owing to the inhibition of Sn atoms diffusion by reinforcement material.