Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

International Conference on Mechanical Engineering, Automation and Control Systems 2017

机械制造;无线电电子学;计算机科学

Sokolov, E.G.^1 ; Aref'Eva, S.A.^1 ; Svistun, L.I.^1

Kuban State Technological University, Moskovskaya St. 2, Krasnodar

350072, Russia^1

关键词: Cobalt powders;    Composite solders;    Diamond abrasive;    Metallic powder;    Organic binders;    Shaped surfaces;    Steel roller;    Tungsten powders;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/327/2/022098/pdf
DOI  :  10.1088/1757-899X/327/2/022098

学科分类：计算机科学（综合）

来源: IOP

【 摘 要 】

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27-35 vol % of solid phase. This is achieved with a total solder content of 24-32 wt % of cobalt powder and 7 wt % of tungsten powder.