Throughput-Centric Wave-Pipelined Interconnect Circuits for Gigascale Integration

Digital integrated circuits;Electronic circuits;High throughput;Interconnect;Low-power;Metal oxide semiconductors;Wave-pipelining;Complementary

Deodhar, Vinita Vasant ; Electrical and Computer Engineering

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Digital integrated circuits;    Electronic circuits;    High throughput;    Interconnect;    Low-power;    Metal oxide semiconductors;    Wave-pipelining;    Complementary;   

Others  :  https://smartech.gatech.edu/bitstream/1853/7503/1/Deodhar_Vinita_V_200512_PhD.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

The central thesis of this research is that VLSI interconnect design strategies should shift from using global wires that can support only a single binary transition during the latency of the line to global wires that can sustain multiple bits traveling simultaneously along the length of the line.It is shown in this thesis that such throughput-centric multibit transmission can be achieved by wave-pipelining the interconnects using repeaters. A holistic analysis of wave-pipelined interconnect circuits, along with the full-custom optimization of these circuits, is performed in this research. With the help of models and methodologies developed in this thesis, the design rules for repeater insertion are crafted to simultaneously optimize performance, power, and area of VLSI global interconnect networks through a simultaneous application of voltage scaling and wire sizing. A qualitative analysis of latency, throughput, signal integrity, power dissipation, and area is performed that compares the results of design optimizations in this work to those of conventional global interconnect circuits. The objective of this thesis is to study the circuit- and system-level opportunities of voltage scaling, wire sizing, and repeater insertion in wave-pipelined global interconnect networks that are implemented in deep submicron technologies.