Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

Journal of Materials Research and Technology

Han-Tang Hung¹  Chin-Hao Tsai¹  Fu-Ling Chang¹  C.R. Kao¹  Steffen Bickel²  Iuliana Panchenko²  Karlheinz Bock²  Maik Müller² 

[1] Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan;Institute of Electronics Packaging Technology, Technische Universität Dresden, Dresden, Germany;

关键词: Electronic materials;    Assembly technology;    Transient liquid phase reaction;    Interfaces;    In–Sn Intermetallics;   

DOI  :  

来源: DOAJ

【 摘 要 】

Sn/In–Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids were formed at the interfaces after bonding, the In–Sn metallization enabled low-temperature bonding due to the low eutectic temperature. A bonding mechanism to achieve this novel In–Sn low-temperature assembly was also proposed.

【 授权许可】

Unknown