Evaluation of thermal degradation of polymer based electronic materials by non-destructive testing

2nd International Conference on Rheology and Modeling of Materials

Rafiee, P.^1 ; Khatibi, G.^1 ; Lederer, M.^1 ; Zehetbauer, M.^2

Vienna University of Technology, Institute of Chemical Technologies and Analytics, Vienna, Austria^1

University of Vienna, Faculty of Physics, Vienna, Austria^2

关键词: Electronic materials;    Experimental modal analysis;    Filled epoxy resins;    High temperature storage;    Microelectronic package;    Non destructive testing;    Surface oxidations;    Vibrational loads;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/790/1/012026/pdf
DOI  :  10.1088/1742-6596/790/1/012026

来源: IOP

【 摘 要 】

Thermal degradation of polymeric materials used in microelectronic packages was studied by means of experimental modal analysis in combination with finite element methods. The devices were subjected to vibrational loads subsequent to various stages of high temperature storage and their modal response was recorded. Statistical methods and finite element analysis were applied to quantify and evaluate the alteration of the modal response of the packages due to the degradation / delamination of the silver filled epoxy adhesive and the glass filled epoxy resin molding compound. It was shown that changes in the material properties of the molding compound due to surface oxidation is the dominant cause for alteration of the modal response of encapsulated packages exposed to high temperatures.