Mechanical reliability of thin barrier films for flexible electronics

Thin film mechanics;PECVD;Silicon nitride;Nanolaminates;Crack onset strain;Environmentally-assisted cracking

Kim, Kyungjin ; Pierron, Olivier N. Graham, Samuel Mechanical Engineering Zhu, Ting Sitaraman, Suresh K. Losego, Mark D. ; Pierron, Olivier N.

University:Georgia Institute of Technology

Department:Mechanical Engineering

关键词: Thin film mechanics;    PECVD;    Silicon nitride;    Nanolaminates;    Crack onset strain;    Environmentally-assisted cracking;   

Others  :  https://smartech.gatech.edu/bitstream/1853/60781/1/KIM-DISSERTATION-2018.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Flexible electronics such as OLEDs, OPVs are currently under development, especially given their potential low cost and light-weight characteristics. These electronics require packaging technologies that protect them from degradation from environmental factors (e.g., water vapor, oxygen, etc.), while also providing high reliability under mechanical deformation. In this work, mechanical failure under tensile strain has been thoroughly studied to scrutinize the integrity of mechanical reliability in brittle thin barrier films. This is because time dependent deformation can be induced especially in the flexible electronics applications such as bendable or foldable devices which are under applied strain for a period of time. Also, nanolaminates with alternative organic and inorganic layers were fabricated, tested and modeled to produce an optimized crack onset strain. Therefore, the aim of this study is to characterize the mechanical reliability using PECVD SiNx, and using nanolaminates, ultimately to create mechanically reliable strong barriers.