Interposer platforms featuring polymer-enhanced through silicon vias for microelectronic systems

Silicon interposer;D-band;W-band;RF;Through-silicon via (TSV);Packaging;Interconnects;Optical interconnects;Antenna;Inductor;Coaxial TSV;Time-domain;De-embedding

Thadesar, Paragkumar A. ; Bakir, Muhannad Electrical and Computer Engineering Brand, Oliver Cressler, John Wang, Hua Sitaraman, Suresh ; Bakir, Muhannad

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Silicon interposer;    D-band;    W-band;    RF;    Through-silicon via (TSV);    Packaging;    Interconnects;    Optical interconnects;    Antenna;    Inductor;    Coaxial TSV;    Time-domain;    De-embedding;   

Others  :  https://smartech.gatech.edu/bitstream/1853/53572/1/THADESAR-DISSERTATION-2015.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Novel polymer-enhanced photodefined through-silicon via (TSV) and passive technologies have been demonstrated for silicon interposers to obtain compact heterogeneous computing and mixed-signal systems. These technologies include: (1) Polymer-clad TSVs with thick (~20 µm) liners to help reduce TSV losses and stress, and obtain optical TSVs in parallel for interposer-to-interposer long-distance communication; (2) Polymer-embedded vias with copper vias embedded in polymer wells to significantly reduce the TSV losses; (3) Coaxial vias in polymer wells to reduce the TSV losses with controlled impedance; (4) Antennas over polymer wells to attain a high radiation efficiency; and (5) High-Q inductors over polymer wells.Cleanroom fabrication and characterization of the technologies have been demonstrated. For the fabricated polymer-clad TSVs, resistance and synchrotron x-ray diffraction (XRD) measurements have been demonstrated. High-frequency measurements up to 170 GHz and time-domain measurements up to 10 Gbps have been demonstrated for the fabricated polymer-embedded vias. For the fabricated coaxial vias and inductors, high-frequency measurements up to 50 GHz have been demonstrated. Lastly, for the fabricated antennas, measurements in the W-band have been demonstrated.