Thin Film Adhesion by Nanoindentation-Induced Superlayers.

Gergerich, W. W. ; Volinsky, A. A.

Technical Information Center Oak Ridge Tennessee

关键词: Thin films;    Adhesion;    Progress report;    Stresses;    Nanostructure;   

RP-ID  :  DE2004809372

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

This work has analyzed the key variables of indentation tip radius, contact radius, delamination radius, residual stress and superlayer/film/interlayer properties on nanoindentation measurements of adhesion. The goal to connect practical works of adhesion for very thin films to true works of adhesion has been achieved. A review of this work titled 'Interfacial toughness measurements of thin metal films,' which has been submitted to Acta Materialia, is included.