Ductile film delamination from compliant substrates using hard overlayers

THIN SOLID FILMS

卷:571

Article

Cordill, M. J.¹  Marx, V. M.²  Kirchlechner, C.² 

[1] Austrian Acad Sci, Erich Schmid Inst Mat Sci, A-1010 Vienna, Austria

[2] Max Planck Inst Eisenforsch GmbH, D-40074 Dusseldorf, Germany

关键词: Thin films;    Adhesion;    Polymer substrates;    Stressed overlayers;    Fragmentation testing;   

DOI  :  10.1016/j.tsf.2014.02.093

来源: Elsevier

【 摘 要 】

Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined areas of delamination to measure the adhesion of copper films on polyimide substrates. The technique utilizes a stressed overlayer and tensile straining to cause buckle formation. The described method allows one to examine the effects of thin adhesion layers used to improve the adhesion of flexible systems. (C) 2014 The Authors. Published by Elsevier B.V.

【 授权许可】

Free