Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers

SURFACE & COATINGS TECHNOLOGY

卷:332

Article; Proceedings Paper

Kleinbichier, A.^1,2,3  Todt, J.^2,3  Zechner, J.¹  Woehlert, S.⁴  Toebbens, D. M.⁵  Cordill, M. J.^2,3 

[1] KAI Kompetenzzentrum Automobil & Ind Elect GmbH, Technol Pk Villach,Europastr 8, A-9524 Villach, Austria

[2] Austrian Acad Sci, Erich Schmid Inst Mat Sci, Jahnstr 12, A-8700 Leoben, Austria

[3] Univ Leoben, Dept Mat Phys, Jahnstr 12, A-8700 Leoben, Austria

[4] Infineon Technol AG, Siemensstr 2, A-9500 Villach, Austria

[5] Helmholtz Zentrum Berlin Mat & Energie, Albert Einstein Str 15, D-12489 Berlin, Germany

关键词: Adhesion;    Thin films;    Scratch test;    Heat treatment;    Film stress;   

DOI  :  10.1016/j.surfcoat.2017.07.087

来源: Elsevier

【 摘 要 】

Tungsten-titanium (WTi) alloys are important barrier materials in microelectronic devices. Thus the adhesion of WTi to silicate glass substrates influences the reliability of these devices. One factor that affects the adhesion of barrier layers are thermal treatments during and after fabrication. To address the impact of annealing, WTi films deposited on silicate glass substrates were subjected to different annealing treatments. The stress development in the WTi film has been monitored with wafer curvature and X-ray diffraction. Quantitative measurements of the adhesion energies were performed using scratch testing to induce interface delamination. Imaging with atomic force microscopy provided the dimensions of the buckles to quantify adhesion energies. Focused ion beam cross sections were used to verify the failing interfaces and to inspect any deformation in the film and the substrate caused by scratch testing. It was found that as the annealing duration increased, the residual compressive stresses in the film and the adhesion energy increased.

【 授权许可】

Free