科技报告详细信息
Ultra-High Temperature Sensors Based on Optical Property Modulation and Vibration-Tolerant Interferometry. Technical Progress Report for July 1, 2005-December 31, 2005.
Riza, N. A.
Technical Information Center Oak Ridge Tennessee
关键词: Optical chip;    Fabrication;    Silicon carbide;    High pressure;    High temperature;   
RP-ID  :  DE2006875888
学科分类:工程和技术(综合)
美国|英语
来源: National Technical Reports Library
PDF
【 摘 要 】

The goals of the second six months of the Phase 2 of this project were to conduct first time experimental studies using optical designs and some initial hardware developed in the first 6 months of Phase 2. One focus is to modify the SiC chip optical properties to enable gas species sensing with a specific gas species under high temperature and pressure. The goal was to acquire sensing test data using two example inert and safe gases and show gas discrimination abilities. A high pressure gas mixing chamber was to be designed and assembled to achieve the mentioned gas sensing needs. Another goal was to initiate high temperature probe design by developing and testing a probe design that leads to accurately measuring the thickness of the deployed SiC sensor chip to enable accurate overall sensor system design. The third goal of this phase of the project was to test the SiC chip under high pressure conditions using the earlier designed calibration cell to enable it to act as a pressure sensor when doing gas detection. In this case, experiments using a controlled pressure system were to deliver repeatable pressure measurement data. All these goals have been achieved and are described in detail in the report. Both design process and diagrams for the mechanical elements as well as the optical systems are provided. Photographs or schematics of the fabricated hardware are provided. Experimental data from the three optical sensor systems (i.e., Thickness, pressure, and gas species) is provided.

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