McCarter Superfinish Grinding for Silicon, An Update.

Anthony, F. ; Khounsary, A. ; McCarter, D. ; Krasnicki, F. ; Tangedahl, M.

Technical Information Center Oak Ridge Tennessee

关键词: Grinding;    Silicon carbide;    Superfinish;    Residual strain;    Etching;   

RP-ID  :  DE2001768602

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

A grinding technique, discussed and certain referred to as the McCarter Superfinish, for grinding large size optical components is surface characterization information about flatness and the relative magnitude of the subsurface damage in silicon substrates is reported. The flatness measurements were obtained with a Zygo surface analyzer, and the substrate damage measurements were made by x-ray diffraction and acid etching. Results indicate excellent control of flatness and fine surface finish. X-ray measurements show that the diamond wheels with small particle sizes used in the final phases of the grinding operation renders surfaces with relatively small subsurface damage.