Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

Nettleship, Ian ; Hinklin, Thomas ; Holcomb, David Joseph ; Tandon, Rajan ; Arguello, Jose Guadalupe, Jr. ; Dempsey, James Franklin ; Ewsuk, Kevin Gregory ; Neilsen, Michael K. ; Lanagan, Michael

Sandia National Laboratories

关键词: Simulation And Modeling;    Computerized Simulation;    Materials.;    Microelectronics;    Integrated Circuits-Materials-Thermomechanical Properties.;   

DOI  :  10.2172/913216
RP-ID  :  SAND2007-4298
RP-ID  :  AC04-94AL85000
RP-ID  :  913216

美国|英语

来源: UNT Digital Library

【 摘 要 】

An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.