Thermal-stress modeling of an optical microphone at high temperature.

Barnard, Casey Anderson

Sandia National Laboratories

关键词: Temperature Range 0400-1000 K;    Thermal Expansion;    Computerized Simulation;    Microelectronics;    42 Engineering;   

DOI  :  10.2172/1005061
RP-ID  :  SAND2010-5939
RP-ID  :  AC04-94AL85000
RP-ID  :  1005061

美国|英语

来源: UNT Digital Library

【 摘 要 】

To help determine the capability range of a MEMS optical microphone design in harsh conditions computer simulations were carried out. Thermal stress modeling was performed up to temperatures of 1000 C. Particular concern was over stress and strain profiles due to the coefficient of thermal expansion mismatch between the polysilicon device and alumina packaging. Preliminary results with simplified models indicate acceptable levels of deformation within the device.