Formation of Ag3Sn plates in SnAgCu solder bumps

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

卷:527

Article

Gong, Jicheng¹  Liu, Changqing²  Conway, Paul P.²  Silberschmidt, Vadim V.² 

[1] Univ Oxford, Dept Mat, Oxford OX1 3PH, England

[2] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England

关键词: Solder;    Solidification;    Crystal growth;    Intermetallics;   

DOI  :  10.1016/j.msea.2009.12.020

来源: Elsevier

【 摘 要 】

Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag3Sn plates out of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is discussed. (C) 2009 Elsevier B.V. All rights reserved.

【 授权许可】

Free