Multiscale Microstructures and Microstructural Effects on the Reliability of Microbumps in Three-Dimensional Integration

Materials

Zhiheng Huang²  Hua Xiong²  Zhiyong Wu²  Paul Conway¹ 

[1] School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough LE11 3TU, UK; E-Mail:;School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou 510275, China; E-Mails:

关键词: 3D integration;    microbump;    multiscale microstructure;    reliability;   

DOI  :  10.3390/ma6104707

来源: mdpi

【 摘 要 】

The dimensions of microbumps in three-dimensional integration reach microscopic scales and thus necessitate a study of the multiscale microstructures in microbumps. Here, we present simulated mesoscale and atomic-scale microstructures of microbumps using phase field and phase field crystal models. Coupled microstructure, mechanical stress, and electromigration modeling was performed to highlight the microstructural effects on the reliability of microbumps. The results suggest that the size and geometry of microbumps can influence both the mesoscale and atomic-scale microstructural formation during solidification. An external stress imposed on the microbump can cause ordered phase growth along the boundaries of the microbump. Mesoscale microstructures formed in the microbumps from solidification, solid state phase separation, and coarsening processes suggest that the microstructures in smaller microbumps are more heterogeneous. Due to the differences in microstructures, the von Mises stress distributions in microbumps of different sizes and geometries vary. In addition, a combined effect resulting from the connectivity of the phase morphology and the amount of interface present in the mesoscale microstructure can influence the electromigration reliability of microbumps.

【 授权许可】

CC BY   
© 2013 by the authors; licensee MDPI, Basel, Switzerland.