Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

Journal of Computational Science and Technology

Soon-Bok LEE¹  Jae-Won JANG¹ 

[1] Department of Mechanical Engineering, KAIST

关键词: Experimental Method;    Numerical Analysis;    Reliability Evaluation;    Electronic Packaging;    Fatigue;   

DOI  :  10.1299/jcst.7.265

学科分类：地球科学(综合)

来源: Japan Academy

【 摘 要 】

References(18)There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.

【 授权许可】

Unknown