会议论文详细信息
2nd International Conference on Advancements in Aeromechanical Materials for Manufacturing
Design and Development of Cantilever 3D Printer Model
航空航天工程;材料科学;机械制造
Venu Gopal, L.^1 ; Sai Krishna Reddy, G.^1
Department of Mechanical Engineering, MLR Institute of Technology, Hyderabad, India^1
关键词: 3-D printing;    Design and Development;    Electronic Packaging;    High quality;    Layer by layer;    picture exa mination;    Printer modeling;    protest investigation;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/455/1/012137/pdf
DOI  :  10.1088/1757-899X/455/1/012137
来源: IOP
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【 摘 要 】

This paper is on Additive assembling is frequently known as 3D printing, where 3dimensoional question made layer by layer as known as Rapid Prototyping, these are made rapidly by interfacing with the PC. This all procedure should be possible on 3D printer parcel more 3D printers are accessible in the market yet they are savvy and made with plastic parts. Life of 3D printer is less. Now my work is to plan and grow ease of 3D printer with every metal part and the choosing of best hot end for printing, and furthermore value variation with independent electronic packaging and with high quality expulsions, and further more high torque engine.

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