Research on Preparation and Performance of Epoxy Resin-Boron Nitride Thermal-Conductive Composite

2018 5th International Conference on Advanced Composite Materials and Manufacturing Engineering

Wu, Xiangnan^1 ; Wang, Zhi^1 ; Chen, Jiuchuan^1 ; Wang, Xiaofeng^2 ; Qu, Xiongwei^2

College of Materials Engineering, North China Institute of Aerospace Engineering, Langfang, Hebei

065000, China^1

School of Materials Science and Engineering, Hebei University of Technology, Tianjin

300130, China^2

关键词: Different mass;    Electronic Packaging;    Electronic packaging material;    Enhanced thermal conductivity;    Hexagonal boron nitride;    Mass fraction;    Mechanical and electrical properties;    Thermal conductive composites;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/394/2/022052/pdf
DOI  :  10.1088/1757-899X/394/2/022052

来源: IOP

【 摘 要 】

Owning to its excellent mechanical and electrical properties of epoxy resin, epoxy resin is widely used in electronic packaging field. However, thermal conductivity of ordinary epoxy resin is only 0.2W/m•K, heat is easy to be accumulated during operation of components, the stress will increase and a series of questions (e.g. cracking of product) would be caused then. Therefore, enhancing of thermal conductivity of epoxy resin is a focal research point in electronic packaging material field. In this study, hexagonal boron nitride was used as the filler, epoxy resin was used as the matrix, the hexagonal boron nitride thermal-conductive insulating composite of different mass fraction was prepared, and the impact of different boron nitride mass fraction on performance of composite was researched. It was discovered during the research that adding of boron nitride (h-BN) filler enhanced thermal conductivity of composite effectively. When mass fraction of h-BN reached to 15%, thermal conductivity of composite was up to 0.6264W/(m•K), increased by 223.72% than that of pure epoxy resin.