High Performance Interconnection Technology in Avionics (Short Communication)

Defence Science Journal

Punya Prabha V.¹  T. N. Sushma¹  H. S. Yeshaswini¹  H. Rashmi¹  C. R. Raghunath¹ 

[1] M.S. Ramaiah Institute of Technology, Bengaluru

关键词: Avionics;    integrated circuits;    large-scale integrated circuits;    packaging technology;    system-on-chip;    laminates systems;    interconnection technology;   

DOI  :  

学科分类：社会科学、人文和艺术（综合）

来源: Defence Scientific Information & Documentation Centre

【 摘 要 】

Avionics subsystems continue to get smaller and more functional, driving the total circuit package itself to become denser, causing the printed wiring board (PWB) to evolve new laminates to meet these needs. There is a continuous scope for improvement to match the requirement of wireability demand from high density and high speed integrated circuits. Development of control processing units and rapid expansion of memory device capabilities were realised by the development of large-scale integrated circuits and other electronic devices with higher integration and with new functionalities. Enormous efforts have been put on the development of the system-on-chip (SOC), where a single semiconductor chip constituting complete system is bonded on substrate. These innovations in packaging technology made a big impact on laminates used in printed circuit boards. Aircraft systems are expected to withstand disturbances due to unexpected threats. Under such situations, passengers' safety, emergency landing and timely information to pilot become of paramount importance, hence, new innovative laminate systems are being developed. Various aspects of laminates and the current developments that are taking place are facilitating scientists and engineers in selecting appropriate laminate systems, have been discussed. Defence Science Journal, 2011, 61(4), pp.354-363 , DOI:http://dx.doi.org/10.14429/dsj.61.1085

【 授权许可】

Unknown