3-D MCM Technology for Miniaturisation of an Electronic System

Defence Science Journal

S. K. Bhowmick¹ 

[1] Advanced Numerical Research & Analysis Group, Hyderabad

关键词: Miniaturisation;    MCM technology;    SIP;    SOC;    multi-chip module;    system-in-a-package;    system-on-a-chip;    electronic systems;    packaging technology;    3-D technology;    system miniaturisation;    tape-automated bonding;   

DOI  :  

学科分类：社会科学、人文和艺术（综合）

来源: Defence Scientific Information & Documentation Centre

【 摘 要 】

Miniaturisation of a bulky system requires effective use and integration of modern packaging technology to achieve smaller size and lighter weight while consuming low power and achieving high speed. Using three-dimensional packaging technology, a system can be miniaturised to a small package popularly known as system-in-a-package (SIP). Various layers of component integration (die or packaged) in the horizontal and vertical directions lead to a compact system in a single package. In this paper, the development of an analog multi-chip module (MCM) is illustrated using 3-D technology. The major goals achieved using this technology are the mixedsignal integration, arealsize reduction, and low power. A comparison is made with the systemon- a-chip (SOC) technology and their merits and demerits are also discussed.

【 授权许可】

Unknown