Effects of Substrate on Thermal and Optical Characteristics of High-Power ThinGaN White LED

3rd International Conference on Manufacturing, Material and Metallurgical Engineering

机械制造;材料科学;冶金学

Raypah, Muna E.^1 ; Devarajan, Mutharasu^1 ; Sulaiman, Fauziah^1

School of Physics, Universiti Sains Malaysia (USM), Penang

11800, Malaysia^1

关键词: Different boundary condition;    Extraction efficiencies;    Junction temperatures;    Light emitting diode (LEDs);    Lighting applications;    Metal core printed circuit board (MCPCB);    Optical characteristics;    Thermal transients;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/409/1/012032/pdf
DOI  :  10.1088/1757-899X/409/1/012032

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Thin Gallium Nitride (ThinGaN)-based light-emitting diodes (LEDs) demonstrate high extraction efficiency and brightness. Their slim designs make them appropriate for lighting applications that demand high luminous flux, small space, and stability. Thermal resistance and junction temperature values under different boundary conditions can help in understanding thermal management of ThinGaN-based LEDs. In this paper, thermal and optical characteristics of ThinGaN (UX:3) white LED mounted on Metal-Core Printed Circuit Board (MCPCB) and a SinkPad MCPCB are investigated. Thermal and optical parameters of the LED are measured by thermal transient tester (T3Ster) and spectrometer devices. Results show that the LED attached to the SinkPad MCPCB obtained lower thermal resistance and junction temperature than MCPCB.