Simulation analysis the effect of heat sink fins on the high-power LED

7th Global Conference on Materials Science and Engineering

工业技术（总论）;材料科学

Peng, D.S.^1 ; Liu, K.L.^1 ; Zhang, M.X.^1 ; Tan, C.C.^1

Key Laboratory of Optoelectronic Devices and Systems, Ministry of Education and Guangdong Province, Shenzhen University, Shenzhen

518060, China^1

关键词: Comparative analysis;    Cooling abilities;    Cooling effects;    Fin thickness;    High power LED;    Junction temperatures;    Simulation analysis;    Thermal Performance;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/474/1/012050/pdf
DOI  :  10.1088/1757-899X/474/1/012050

来源: IOP

【 摘 要 】

In this study, the heat dissipation of high-power LED with different heat sink fin thickness and space values is analyzed in detail, in order to tackle the problem of high-power LED overheating. It is shown that an increase in the heat sink fins' thickness initially improves the high-power LED cooling effect, but this improvement is not obvious until the above thickness reaches 3 mm. At the same time, the heat sink fins' space can also enhance the cooling effect, but when it attains 5mm, the cooling ability is decreased instead. Through the comparative analysis of the thermal performance of high-power LED with different heat sink fins thickness and space values, it is proved that the junction temperature is minimum, when the heat sink fin thickness and space are 3 and 5mm, respectively.