Numerical simulation and experimental research of the integrated high-power LED radiator

5th Global Conference on Materials Science and Engineering

Xiang, J.H.^1 ; Zhang, C.L.^1 ; Gan, Z.J.^1 ; Zhou, C.^1 ; Chen, C.G.^1 ; Chen, S.^1

School of Mechanical and Electric Engineering, Guangzhou University, Guangzhou

510006, China^1

关键词: Cooling fins;    Experimental research;    Fin thickness;    High power LED;    Measured values;    Phase change heat transfer;    Urgent problems;    Vapor chamber;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/164/1/012001/pdf
DOI  :  10.1088/1757-899X/164/1/012001

来源: IOP

【 摘 要 】

The thermal management has become an urgent problem to be solved with the increasing power and the improving integration of the LED (light emitting diode) chip. In order to eliminate the contact resistance of the radiator, this paper presented an integrated high-power LED radiator based on phase-change heat transfer, which realized the seamless connection between the vapor chamber and the cooling fins. The radiator was optimized by combining the numerical simulation and the experimental research. The effects of the chamber diameter and the parameters of fin on the heat dissipation performance were analyzed. The numerical simulation results were compared with the measured values by experiment. The results showed that the fin thickness, the fin number, the fin height and the chamber diameter were the factors which affected the performance of radiator from primary to secondary.