Analysis of a passive heat sink for temperature stabilization of high-power LED bulbs

23rd Congress of the International Commission for Optics

Balvís, Eduardo^1 ; Bendaña, Ricardo^2 ; Michinel, Humberto^2 ; De Córdoba, Pedro Fernández^3 ; Paredes, Angel^2

Innebo Ingeniería, Lugar Do Penedo, S. Cibrao das Viñas, Ourense

32910, Spain^1

Facultade de Ciencias, Universidade de Vigo, As Lagoas s/n, Ourense

32004, Spain^2

IUMPA, Universitat Politècnica de València, Camino de Vera 14, Valencia

46022, Spain^3

关键词: High power LED;    LED chips;    Light bulbs;    Low-cost devices;    Measurements of;    Numerical calculation;    Temperature stabilization;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/605/1/012005/pdf
DOI  :  10.1088/1742-6596/605/1/012005

来源: IOP

【 摘 要 】

In this paper we present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminum passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 70° C yielding long-term operation of the device. Our simulations have been performed for a low-cost device ready to install in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.