Thermal interface material characterization for cryogenic electronic packaging solutions

Cryogenic Engineering Conference 2017

材料科学;物理学

Dillon, A.^1 ; McCusker, K.^1 ; Van Dyke, J.^1 ; Isler, B.^1 ; Christiansen, M.^1

Northrop Grumman Corporation, Mission Systems Sector, 1580-A West Nursery Road, Linthicum

MD

21090, United States^1

关键词: Applied forces;    Cryogenic electronics;    Development and testing;    Indium foils;    Interface materials;    Logic technology;    Thermal conductance;    Thermal interface materials;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/278/1/012054/pdf
DOI  :  10.1088/1757-899X/278/1/012054

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.