Integrated Cryogenic Electronics Testbed (ICE-T) for Evaluation of Superconductor and Cryo-Semiconductor Integrated Circuits

26th International Cryogenic Engineering Conference & International Cryogenic Materials Conference 2016

材料科学;物理学

Dotsenko, V.V.^1 ; Sahu, A.^1 ; Chonigman, B.^1 ; Tang, J.^1 ; Lehmann, A.E.^1 ; Gupta, V.^1 ; Talalevskii, A.^1 ; Ruotolo, S.^1 ; Sarwana, S.^1 ; Webber, R.J.^1 ; Gupta, D.^1

HYPRES Inc., 175 Clearbrook Road, Elmsford

NY

10523, United States^1

关键词: Cryogenic applications;    Cryogenic electronics;    Electrical connection;    Electrical interface;    Iterative development;    Mixed-signal circuits;    Research and development;    Semiconductor integrated circuits;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/171/1/012145/pdf
DOI  :  10.1088/1757-899X/171/1/012145

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Research and development of cryogenic application-specific integrated circuits (ASICs), such as high-frequency (tens of GHz) semiconductor and superconductor mixed-signal circuits and large-scale (>10,000 Josephson Junctions) superconductor digital circuits, have long been hindered by the absence of specialized cryogenic test apparatus. During their iterative development phase, most ASICs require many additional input-output lines for applying independent bias controls, injecting test signals, and monitoring outputs of different sub-circuits. We are developing a full suite of modular test apparatus based on cryocoolers that do not consume liquid helium, and support extensive electrical interfaces to standard and custom test equipment. Our design separates the cryogenics from electrical connections, allowing even inexperienced users to conduct testing by simply mounting their ASIC on a removable electrical insert. Thermal connections between the cold stages and the inserts are made with robust thermal links. ICE-T accommodates two independent electrical inserts at the same time. We have designed various inserts, such as universal ones with all 40 or 80 coaxial cables and those with customized wiring and temperature-controlled stages. ICE-T features fast thermal cycling for rapid testing, enables detailed testing over long periods (days to months, if necessary), and even supports automated testing of digital ICs with modular additions.