Multiple-height microstructure fabricated by deep reactive ion etching and soft resist masks combined with UV curing

26th Symposium on Plasma Sciences for Materials

物理学;材料科学

Sato, R.^1 ; Sawada, T.^1 ; Kumagai, S.^1 ; Sasaki, M.^1

Department of Advanced Science and Technology, Toyota Technological Institute, 212-1 Hisakata, Nagoya, Tenpaku-ku, 468-8511, Japan^1

关键词: Deep Reactive Ion Etching;    Mask process;    MEMSDevices;    Resist pattern;    Soft masks;    UV cured;    UV exposure;    UV-curing;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/518/1/012012/pdf
DOI  :  10.1088/1742-6596/518/1/012012

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Multiple-height microstructures are realized by deep reactive ion etching and UV-cured photoresist used in the embedded mask process. Although the UV-cured photoresist is a soft mask, its material property becomes stable against resist thinner and UV exposure. A layered resist pattern can be realized by stacking normal photoresist on the UV-cured photoresist. The normal photoresist can be selectively removed by the flush exposure and developing after the first Si etching. This technique is applied to two MEMS devices.