Deposition of Functional Membranes by Through-Substrate Plane-Plate Dielectric-Barrier Discharge

11th Asia Pacific Conference on Plasma Science and Technology;25th Symposium on Plasma Science for Materials

Kobayashi, H.^1 ; Kakiuchi, H.^2 ; Yasutake, K.^2 ; Suzuki, T.^3 ; Noborisaka, M.^3 ; Negishi, N.^1

Central Research Laboratory, Hitachi, Ltd., 1-280 Higashi-koigakubo Kokubunji-shi, 185-8601 Tokyo, Japan^1

Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan^2

Center for Science of Environment, Resource and Energy, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, 223-8522, Japan^3

关键词: Deposition methods;    Diamond like carbon;    Dielectric barrier discharge plasmas;    Dielectric barrier discharges;    Film substrates;    Functional membranes;    Substrate films;    Substrate planes;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/441/1/012024/pdf
DOI  :  10.1088/1742-6596/441/1/012024

来源: IOP

【 摘 要 】

A novel roll-to-roll deposition method, namely, "through-substrate plane-plate dielectric-barrier discharge," was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.