Criteria for the process of drawing copper microwire for electronics

International Workshop "Advanced Technologies in Material Science, Mechanical and Automation Engineering – MIP: Engineering – 2019"

材料科学;机械制造;原子能学

Volkov, A.V.^1 ; Sokolova, I.D.^1 ; Korzhavyi, A.P.^1 ; Beckel, L.S.^1

Kaluga Branch, Bauman Moscow State Technical University, Kaluga, Russia^1

关键词: Complex task;    Drawing process;    Electrical connection;    High quality;    Microelectronic industry;    Peripheral speed;    Physical and chemical properties;    Preliminary analysis;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/537/3/032065/pdf
DOI  :  10.1088/1757-899X/537/3/032065

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

The paper provides information on the use of the developed mathematical model of repeated drawing with the sliding of a microwire from copper, intended for the installation of intracircuit electrical connections of microcircuits. Creation of a microwire based on copper for internal electric contact connections is a complex task: in the world practice, only a few firms can produce such a material that fully meets the requirements of the microelectronic industry. To obtain the specified microwire, it is necessary to work on the creation of high quality micro-alloyed copper; make a serious adjustment of the process of obtaining microwires, taking into account the complex of physical and chemical properties of the material. The article defines the criteria for the stability of the process of drawing during modelling, suitable for designing transitions of diamond dies. An analysis of the slip drawing process criteria, the safety factor of the drawing transitions, and the peripheral speeds of the pulls and wires to ensure the selection of both theoretically accepted and actually specified transitions of diamond dies is given. Based on a preliminary analysis of the model, recommendations are presented for its further improvement with the use of the criteria for the stability of the drawing process in order to increase the reliability of the process of obtaining a copper microwire for electronics.