Simulation of a copper micro-wire drawing for electronics

International Workshop "Advanced Technologies in Material Science, Mechanical and Automation Engineering – MIP: Engineering – 2019"

材料科学;机械制造;原子能学

Volkov, A.V.^1 ; Sokolova, I.D.^1 ; Korzhavyi, A.P.^1 ; Beckel, L.S.^1

Kaluga Branch, Bauman Moscow State Technical University, Kaluga, Russia^1

关键词: Corrosion damage;    Deformation parameter;    Drawing process;    Electrical connection;    Microelectronic industry;    Production methods;    Technical challenges;    Technological process;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/537/3/032054/pdf
DOI  :  10.1088/1757-899X/537/3/032054

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

The paper discusses the application of the mathematical model of repeated drawing with the sliding of a micro-wire made of copper, intended for the installation of intracircuit electrical connections of microcircuits. Creating production methods and methods for producing microwires based on copper is a complex scientific and technical challenge: only individual firms can produce material that fully meets the needs of the microelectronic industry [1-3]. Therefore, it is necessary to work on the creation of a micro alloyed alloy with rational deformation parameters and providing protection against corrosion damage during micro welding, sealing and operation of devices. The algorithm of the mathematical model applied in the design of drawing transitions is presented. Based on the analysis of the model, recommendations were made for its further improvement in order to increase the reliability of the drawing process with the involvement of process stability criteria. In modelling the technological process of drawing copper, an algorithm developed by the authors for drawing aluminium microwire was used, taking into account the changes needed to make a different material [4-8].