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1 Simulation of a copper micro-wire drawing for electronics [会议论文]

作者:Volkov, A.V.^1;Sokolova, I.D.^1;Korzhavyi, A.P.^1;等

关键词:Corrosion damage;Deformation parameter;...

会议举办机构:Kaluga Branch, Bauman Moscow State Technical University, Kaluga, Russia^1

会议时间:2019

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2 Stability investigation of water based exfoliated graphene nanofluids [会议论文]

作者:Arifutzzaman, A.^1;Ismail, A.F.^2;Yaacob, I.I.^1;等

关键词:Digital photographs;Exfoliated graphene;...

会议举办机构:Department of Manufacturing and Materials Engineering, Faculty of Engineering, International Islamic University Malaysia, Malaysia^1

会议时间:2019

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3 A systematic review of retrofitting tools for residential buildings [会议论文]

作者:Gonzalez-Caceres, A.^1^2, Rabani, M.^1, Wegertseder Martinez, P.A.^3

关键词:Building retrofitting;Construction costs;...

会议举办机构:Department of Civil Engineering and Energy Technology, Oslo Metropolitan University, Norway^1

会议时间:2019

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4 Challenges of retrofitting affordable housing to net-zero carbon in the United Arab Emirates [会议论文]

作者:Mokhtar, A.^1

关键词:Affordable housing;Building typologies;...

会议举办机构:American University of Sharjah, Sharjah, United Arab Emirates^1

会议时间:2019

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5 Microstructure, Friction and Wear of Aluminum Matrix Composites [会议论文]

作者:Florea, R.M.^1

关键词:Aluminum alloy composites;Aluminum alloy materials;...

会议举办机构:Gheorghe Asachi Technical University of Iasi, Department of Materials Science and Engineering, Prof. Dr. D-tru Mangeron Street, Iasi

会议时间:2018

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6 A Review on 3D printing of piezoelectric materials [会议论文]

作者:Cholleti, Eshwar Reddy^1

关键词:3D-printing;Contact poling;...

会议举办机构:University of Auckland, New Zealand^1

会议时间:2018

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