Physical Design Automation for System-on-Packages and 3D-Integrated Circuits

Physical design;3D technologies

Minz, Jacob Rajkumar ; Electrical and Computer Engineering

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Physical design;    3D technologies;   

Others  :  https://smartech.gatech.edu/bitstream/1853/14012/1/minz_jacob_r_200612_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

The focus of this research was to develop interconnect-centricphysical design tools for 3D technologies. A new routing model for the SOP structure was developed whichincorporated the 3D structure and formalized the resource structurethat facilitated the development of the global routing tool.The challenge of thiswork was to intelligently convert the 3D SOP routing problem into a setof 2D problems which could be solved efficiently.On the lines of MCM, the global routing problemwas divided into a number of phases namely, coarse pin distribution,net distribution, detailed pin distribution, topology generation, layerassignment, channel assignment and local routing. The novelty in thisparadigm is due to the feed-through vias needed by the nets which traversethrough multiple placement layers. To gain further improvements inperformance, opticalrouting was proposed and a cost analysis study was done. The areas forthe placement of waveguides were efficiently determined, which reduceddelays and maximized utilization.The global router developed was integrated into a simulated-annealing basedfloorplanner to investigate trade-offs of various objectives. Since power-supplynoise suppression is of paramount importance in SOP, a model was developedfor the SOP power-supply network. Decap allocation, andinsertion were also integrated into the framework. The challengesin this work were to integrate computationally intensive analysis tools witha floorplanning that works to its best efficency provided the evaluation ofthe cost functions are rapid. Trajectory-based approaches were used to samplerepresentative data points for congestion analysis and interpolate thethe congestion metric during the optimization schedule. Efficientalgorithms were also proposed for 3D clock routing, which acheivedequal skews under uniform and worst thermal profiles. Otherobjectives such aswirelength, through-vias, andpower were also handled.