Physical Design of Optoelectronic System-on-a-Chip/Package Using Electrical and Optical Interconnects: CAD Tools and Algorithms

Optical interconnect;Place and route;Physical design;Modeling;Optimization;Clock routing;System-on-a-chip

Seo, Chung-Seok ; Electrical and Computer Engineering

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Optical interconnect;    Place and route;    Physical design;    Modeling;    Optimization;    Clock routing;    System-on-a-chip;   

Others  :  https://smartech.gatech.edu/bitstream/1853/4842/1/seo_chungseok_200412_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power.This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.