Improvements for chip-chip interconnects and MEMS packaging through MEMS materials and processing research

Interconnects;MEMS packaging;Electroless copper;Sacrificial polymer

Uzunlar, Erdal ; Kohl, Paul A. Chemical and Biomolecular Engineering Hess, Dennis W. Filler, Michael A. Naeemi, Azad Joshi, Yogendra ; Kohl, Paul A.

University:Georgia Institute of Technology

Department:Chemical and Biomolecular Engineering

关键词: Interconnects;    MEMS packaging;    Electroless copper;    Sacrificial polymer;   

Others  :  https://smartech.gatech.edu/bitstream/1853/53509/1/UZUNLAR-DISSERTATION-2015.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Improvements for Chip-Chip Interconnects and MEMS Packaging Through Materials and Processing ResearchErdal Uzunlar129 PagesDirected by Dr. Paul A. KohlThe work presented in this dissertation focuses on improvements for ever-evolving modern microelectronic technology. Specifically, three topics were investigated in this work: electroless copper deposition on printed wiring boards (PWBs), polymer-based air-gap microelectromechanical systems (MEMS) packaging technology, and thermal stability enhancement in sacrificial polymers, such as poly(propylene carbonate) (PPC). In the electroless copper deposition study, Ag-based catalysts were identified as a low-cost and equally active alternative to expensive Pd-based catalysts. Hot H2SO4 treatment of PWBs was found as a non-roughening surface treatment method to minimize electrical losses. In MEMS packaging study, a sacrificial polymer-based air-gap packaging technique was improved in terms of identification and simplification of air-gap formation process options, optimization of thermal treatment steps, assessing air-gap formation performance, and analyzing the chemical composition of residue. It was found that non-photosensitive PPC leaves less residue, and creates more reliable air-gaps. The mechanical strength of air-gaps was found to come from residual stress in benzocyclobutene (BCB) caps. In thermal stability of PPC study, the mechanism of thermal stability increase on copper (Cu) surfaces was found as the complex formation between Cu(I) and iodonium of the photoacid generator (PAG), leading to hindrance of acid formation by PAG and restriction of acid-catalyzed decomposition of PPC.