The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Proceedings

Braun, Tanja¹  Roshanghias, Ali²  Dreissigacker, Marc³  Ma, Ying⁴ 

[1] Author to whom correspondence should be addressed;CTR Carinthian Tech Research, 9524 Villach, Austria;Fraunhofer IZM, 13355 Berlin, Germany;Technical University Berlin, Microperipheric Center, 13355 Berlin, Germany

关键词: MEMS packaging;    inkjet printing;    fan-out wafer level packaging;    rdl;    rapid prototyping;   

DOI  :  10.3390/proceedings2130703

学科分类：社会科学、人文和艺术（综合）

来源: mdpi

【 摘 要 】

The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs) are formed by a combination of photolithography, sputtering and plating process. Alternatively, in this study, inkjet-printed RDLs were introduced for FOWLP. In contrast to a subtractive method (e.g., photolithography), additive manufacturing techniques allow depositing the material only where it is desired. In the current study, RDL structures for different embedded modules were realized by inkjet printing and further characterized by electrical examinations. It was proposed that a digital printing process can be a more efficient and lower-cost solution especially for rapid prototyping of RDLs, since several production steps will be skipped, less material will be wasted and the supply chain will be shortened.

【 授权许可】

CC BY