A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

Sensors

Yi-Ren Huang¹  Sheng-An Kuo¹  Michal Stach¹  Chia-Hsing Liu²  Kuan-Hsun Liao¹ 

[1] Institute of NanoEngineering and MicroSystems, National Tsing Hua University, No. 101, Section 2, Kuang Fu Road, Hsin Chu 30013, Taiwan; E-Mails:;Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang Fu Road, Hsin Chu 30013, Taiwan; E-Mail:

关键词: curvature sensor;    flexible electronics;    inkjet printing;   

DOI  :  10.3390/s120404172

来源: mdpi

【 摘 要 】

A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 × 10⁻² mm⁻¹ and the sensing patch has a thickness of less than 130 μm and 20 × 20 mm² dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors.

【 授权许可】

CC BY   
© 2012 by the authors; licensee MDPI, Basel, Switzerland.