Direct metallisation of polyetherimide substrates by activation with different metals

SURFACE & COATINGS TECHNOLOGY

卷:360

Article

Jones, Thomas D. A.^1,3  Ryspayeva, Assel¹  Esfahani, Mohammadreza N.²  Shuttleworth, Matthew P.²  Harris, Russell A.²  Kay, Robert W.²  Desmulliez, Marc P. Y.¹  Marques-Hueso, Jose¹ 

[1] Heriot Watt Univ, Sch Engn & Phys Sci, Nat Inspired Mfg Ctr, Edinburgh EH14 4AS, Midlothian, Scotland

[2] Univ Leeds, Future Mfg Proc Res Grp, Sch Mech Engn, Leeds LS2 9JT, W Yorkshire, England

[3] Univ Dundee, Sch Sci & Engn, Dundee DD1 4HN, Scotland

关键词: Direct metallisation;    Photoreduction;    Polyetherimide;    Electroless copper;    Metal catalyst;    Electrical interconnect;   

DOI  :  10.1016/j.surfcoat.2019.01.023

来源: Elsevier

【 摘 要 】

This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2,0 +/- 0.5) x 10(7) S/m and (3.6 +/- 0.2) x 10(7) S/m, respectively) compared with bulk copper (5.96 x 10(7) S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 mu m width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photo-initiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

【 授权许可】

Free