Advanced Modeling and Simulation to Design and Manufacture High Performance and Reliable Advanced Microelectronics and Microsystems.

Ewsuk, K. G. ; Hinklin, T. ; Neilsen, M. ; Tandon, R. ; Arguello, J. G.

Technical Information Center Oak Ridge Tennessee

关键词: Microsystems;    Integrated circuits;    Thermomechanical properties;    Simulation;    Modeling;   

RP-ID  :  DE2007913216

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The teams efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in real systems, including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.