NASA Electronic Parts and Packaging (NEPP) Program: Overview and Technology Focus Areas - Responsive Technology Assurance for Civil Space

Pellish, Jonathan A ; Majewicz, Peter J ; Sampson, Michael J

关键词: ELECTROMECHANICS;    ELECTRONIC PACKAGING;    LEADERSHIP;    INDUSTRIES;    PERFORMANCE TESTS;    ELECTRONICS;   

RP-ID  :  GSFC-E-DAA-TN66532

学科分类：电子与电气工程

美国|英语

来源: NASA Technical Reports Server

【 摘 要 】

NASA Electronic Parts and Packaging (NEPP) Program Overview and Technology Highlights – The NEPP Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of electrical, electronic, and electromechanical parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP. This presentation highlights key focus areas for 2019.