NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

LaBel, Kenneth A ; Sampson, Michael J ; Pellish, Jonathan A ; Majewicz, Peter J

关键词: ELECTRONIC PACKAGING;    ELECTRICAL ENGINEERING;    ELECTROMECHANICS;    RADIATION TOLERANCE;    ASSURANCE;    RADIATION HARDENING;    RELIABILITY ANALYSIS;    COMMERCIAL OFF-THE-SHELF PRODUCTS;    ELECTRONIC EQUIPMENT;    ELECTRONIC EQUIPMENT TESTS;    CUBESATS;    AEROSPACE INDUSTRY;    RADIATION EFFECTS;   

RP-ID  :  GSFC-E-DAA-TN65883,GSFC-E-DAA-TN54568

美国|英语

来源: NASA Technical Reports Server

【 摘 要 】

NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.