科技报告详细信息
NASA Electronic Parts and Packaging (NEPP) Program - Resources for SmallSats on EEE Parts
Label, Kenneth A ; Pellish, Jonathan A ; Majewicz, Peter J
关键词: ELECTRONIC PACKAGING;    SMALL SATELLITE TECHNOLOGY;    ELECTROMECHANICS;    RELIABILITY;    RISK;    RADIATION EFFECTS;   
RP-ID  :  GSFC-E-DAA-TN59835
学科分类:电子与电气工程
美国|英语
来源: NASA Technical Reports Server
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【 摘 要 】

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

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