Ultrasonic evaluation of beryllium-copper diffusion bonds

Jamieson, E.E.

Kansas City Plant (U.S.)

关键词: Copper;    Adhesion;    Joints;    36 Materials Science;    Performance Testing;   

DOI  :  10.2172/756292
RP-ID  :  KCP-613-6332
RP-ID  :  AC04-76DP00613
RP-ID  :  756292

美国|英语

来源: UNT Digital Library

【 摘 要 】

A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths.