Chemical strategies for die/wafer submicron alignment and bonding.

Martin, James Ellis ; Baca, Alicia I. ; Chu, Dahwey ; Rohwer, Lauren Elizabeth Shea

Sandia National Laboratories

关键词: Thiols;    Gold;    Dies;    Miniaturization;    Interfaces;   

DOI  :  10.2172/1008133
RP-ID  :  SAND2010-6504
RP-ID  :  AC04-94AL85000
RP-ID  :  1008133

美国|英语

来源: UNT Digital Library

【 摘 要 】

This late-start LDRD explores chemical strategies that will enable sub-micron alignment accuracy of dies and wafers by exploiting the interfacial energies of chemical ligands. We have micropatterned commensurate features, such as 2-d arrays of micron-sized gold lines on the die to be bonded. Each gold line is functionalized with alkanethiol ligands before the die are brought into contact. The ligand interfacial energy is minimized when the lines on the die are brought into registration, due to favorable interactions between the complementary ligand tails. After registration is achieved, standard bonding techniques are used to create precision permanent bonds. We have computed the alignment forces and torque between two surfaces patterned with arrays of lines or square pads to illustrate how best to maximize the tendency to align. We also discuss complex, aperiodic patterns such as rectilinear pad assemblies, concentric circles, and spirals that point the way towards extremely precise alignment.